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Association
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Semiconductor O-Rings & Seals
High-purity, plasma-resistant seals for wafer fab process tools and equipment. We supply FFKM, fluorocarbon (FKM), Viton ETP, PTFE, and fluorosilicone o-rings engineered for the aggressive chemistries, plasma, vacuum, and thermal cycling of semiconductor manufacturing — with cleanroom-handled, low-outgassing options to protect device yield.
High-Purity FFKM
Plasma & Reactive-Gas Resistant
Low Outgassing / Vacuum
Cleanroom Options
Fab processes we seal
- Plasma etch (RIE) & ashing
- Deposition — CVD, PECVD, PVD, ALD
- Chemical mechanical planarization (CMP)
- Lithography, ion implant, diffusion / RTP
- Wet clean / wet etch & gas delivery
Semiconductor process seals do a harder job than almost any other o-ring application: they must survive aggressive fluorine and oxygen plasmas, corrosive process gases and slurries, high vacuum, and rapid thermal cycling — all while contributing virtually no particles, metal ions, or outgassed contaminants that would reduce device yield. Material selection here is a purity and plasma-resistance problem as much as a chemical-compatibility one. This page maps fab processes to the right seal material and explains the performance attributes — plasma resistance, low outgassing, high purity, low compression set — that matter most in the fab.
Select a seal by fab process
Match the process and its dominant chemistry or environment to the seal material. In plasma and high-temperature process zones, FFKM is usually the answer; in wet and gas-delivery areas, the choice widens.
Semiconductor material selector
Match the process zone, the dominant chemistry or environment, and the seal material — then confirm purity grade for the tool.
| Process / zone | Dominant chemistry / environment | Recommended material | Material |
|---|---|---|---|
| Plasma etch (RIE), ashing, strip | Fluorine / oxygen plasma, heat | High-purity FFKM (plasma grade) | FFKM → |
| Deposition — CVD / PECVD / PVD / ALD | Reactive precursors, heat, vacuum | FFKM; FKM in cooler zones | FFKM → |
| CMP (planarization) | Abrasive slurries, water, mild chemistry | FKM or FFKM | FKM → |
| Wet clean / wet etch | Acids, solvents, ozone (HF, SPM, SC1/SC2) | PTFE, Teflon-encapsulated, Viton ETP | PTFE → |
| Gas delivery / vacuum lines | High vacuum, low outgassing required | Low-outgassing FFKM | FFKM → |
| Aggressive solvent / chemical exposure | Amines, polar solvents, harsh chemistry | Viton ETP or FFKM | Viton ETP → |
Not sure of the dominant chemistry for your tool? Use our chemical compatibility lookup or send the process conditions with your RFQ.
Performance attributes that matter in the fab
Plasma & reactive-gas resistance
Fluorine and oxygen plasmas erode ordinary elastomers, generating particles and shortening seal life. Plasma-resistant FFKM grades are formulated with specialized fillers to minimize erosion and particle generation in etch and strip chambers, extending wet-clean intervals and protecting yield.
High purity — low metal ions & extractables
In the fab, the seal must not contaminate the wafer. High-purity FFKM grades are compounded for very low metal-ion content and low extractables, so the seal itself does not become a defect source.
Low outgassing & vacuum integrity
For vacuum process and transfer chambers, low-outgassing materials maintain base pressure and avoid depositing volatile contaminants on the wafer. FFKM and selected grades are screened for outgassing and can be vacuum-baked for the most demanding tools.
Thermal stability & low compression set
Process tools cycle hot and cold thousands of times. FFKM holds its sealing force at elevated temperature with low compression set, so the seal recovers and keeps sealing across the maintenance interval rather than taking a permanent set and leaking.
Cleanroom manufacturing & packaging
For contamination-critical tools we supply cleanroom-manufactured o-rings compliant with ISO 14644 — ISO Class 5 (Class 100), ISO Class 6 (Class 1,000), and ISO Class 8 (Class 100,000). Semiconductor work typically calls for ISO Class 5. Cleanroom washing and packaging limit the particle and ionic contamination the seal itself can introduce.
Specify a purity grade
Request a Quote → FFKM gradesPlasma-resistant, high-purity, low-outgassing FFKM to spec.
Semiconductor seal materials
The sealing materials most used across semiconductor process tools. FFKM is the premium plasma- and chemical-resistant choice; fluoropolymers and specialty FKM cover wet and chemical zones.
| Material | Strengths in the fab | Typical zones |
|---|---|---|
| FFKM (perfluoroelastomer) | Best plasma & chemical resistance (amines, ketones, solvents, steam); high purity; high temp; low outgassing. Peroxide-cured grades (e.g. AMS 7257) available | Etch, deposition, vacuum, gas delivery |
| FKM (Viton-class) | Good heat & chemical resistance at lower cost than FFKM | CMP, cooler deposition zones, facilities |
| Viton ETP | Extended chemical resistance (amines, solvents, bases) | Aggressive wet chemistry |
| PTFE | Near-universal chemical inertness; static seals & fittings | Wet clean / wet etch, chemical lines |
| Teflon-encapsulated | PTFE jacket with elastomer core — chemical resistance + resilience | Aggressive media needing seal recovery |
| Fluorosilicone (FVMQ) | Fuel/solvent resistance with wide temperature range | Selected facilities & subsystems |
Why source semiconductor seals from us
High-purity FFKM
Plasma-resistant, low-metal-ion, low-outgassing FFKM grades.
Cleanroom options
Cleanroom-manufactured seals (ISO Class 5/6/8) to limit particle contamination.
Material breadth
FFKM, FKM, Viton ETP, PTFE, encapsulated, and FVMQ from one source.
ISO 9001 quality
ISO 9001 quality system with documentation and traceability on request.
Semiconductor sealing FAQ
What o-ring material is best for semiconductor plasma etch chambers?
High-purity, plasma-resistant FFKM (perfluoroelastomer) is the standard material for semiconductor plasma etch and strip chambers. Specialized FFKM grades resist erosion from fluorine and oxygen plasmas, generate very few particles, and contribute low metal-ion contamination, which protects device yield and extends the interval between wet cleans. Ordinary FKM and other elastomers erode quickly in plasma and are generally not used in the etch chamber itself.
Why is FFKM used so heavily in semiconductor manufacturing?
FFKM (perfluoroelastomer) combines the broadest chemical resistance of any elastomer with high-temperature capability, low outgassing, and high purity. In a fab, a seal must survive aggressive plasma and process chemistry while adding almost no particles, metal ions, or outgassed contaminants. FFKM meets all of those requirements at once, which is why it dominates etch, deposition, and vacuum applications despite its higher cost.
What does "low outgassing" mean for a vacuum process seal?
Low outgassing means the seal material releases very little volatile material under vacuum and heat. In semiconductor vacuum chambers, outgassed species can raise base pressure and deposit contaminants on the wafer. Low-outgassing FFKM and selected grades are screened for outgassing and can be vacuum-baked before use, helping the tool reach and hold its base pressure without contaminating the process.
Which seals work for wet etch and wet clean chemistries?
For wet etch and wet clean (acids, solvents, ozone, and mixtures such as SPM, SC1, and SC2), the most chemically inert materials are preferred: PTFE and Teflon-encapsulated o-rings for near-universal resistance, and Viton ETP where extended resistance to amines and polar solvents is needed with more elastomer resilience than PTFE. The best choice depends on the specific chemistry, temperature, and whether the seal is static or dynamic.
Do you offer cleanroom-handled o-rings?
Yes. We supply cleanroom-manufactured o-rings compliant with ISO 14644 — ISO Class 5 (Class 100), ISO Class 6 (Class 1,000), and ISO Class 8 (Class 100,000) — with cleanroom washing and packaging to limit particle contamination. Semiconductor applications typically require ISO Class 5. Available in high-purity FFKM and other process-appropriate materials; specify the cleanliness and purity requirements for your tool on the RFQ and we will match the grade and handling.
Get semiconductor sealing support
Request a quote
Send your process, chemistry, temperature, and size or AS568 dash number. We quote high-purity FFKM and process-matched seals with cleanroom options.
Request a Quote →Material recommendation
Not sure which grade fits your tool and chemistry? Use our compound-request form and our team will recommend a material.
Get a Recommendation →Trade names referenced (e.g. Viton and Viton ETP for fluorocarbon FKM chemistries; Teflon for PTFE) identify generic material chemistries; trademarks are the property of their respective owners and used for identification only. Material recommendations are general engineering guidance and are grade- and process-dependent — confirm purity, plasma, and chemical requirements for your specific tool before release.
